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Use Case Proposals for P2654

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Following the format used in Volume 2 of the SJTAG White Paper v2 draft.

(Proposed by Jan Schat)

Aging measurement (AME)

Aging measurement refers to measuring slow, more or less reproducible, more or less deterministic aging processes. Measurement is usually done locally on a chip, but the aging data may be transferred from client ICs to a host IC using a 2654-compliant interface; the host IC may perform calculation of aging data, initiate counter measures, issue warnings of imminent system fail etc.

AME Application Fields

Aging measurement refers to measuring slow, more or less reproducible, more or less deterministic aging processes like

  • NBTI (Negative Bias Temperature Instability),
  • electromigration,
  • HCI (Hot Carrier Injection),


AME Detailed Description

AME Alternative Techniques

Overconstrained robust design that doesn't need aging measurement; non-critical designs that are allowed to fail after a certain life time; redundancy are but a few alternatives.

AME Tooling Requirements

AME Value Proposition

AME Consequences

Aging mitigation (AMI)

Aging mitigation comprises a number of techniques to slow down or even revers the aging process in semiconductors. Wear-leveling in SSDs / Flash memories is a separate item, it is not covered here.

AMI Application Fields

AMI Detailed Description

  • Back-Biasing
  • Recovery Patterns for SRAMs
  • Thermal Throttling

AMI Alternative Techniques

AMI Tooling Requirements

AMI Value Proposition

AMI Consequences

Counterfeit prevention(CP)

Counterfeit prevention refers to measures that prevent activities like: - Fabs over-producing wafers and selling them thru non-official channels - (cheap, low-quality, low-performance) ICs from one manufacturer to be re-labeled and sold as expensive, high-quality, high-performance ICs - Using backdoors in ICs to activate functions that have been purposefully disabled, in order to sell the IC at a higher price

CP Application Fields

CP Detailed Description

CP usually employs state-of-the-art techniques of authentication. In complex systems involving several ICs on a PCB, this may involves communication across IC borders, using different protocols, and involving direct communication from one instrument to another. One instrument might be concerned with authentication and may manage a cryptographic challenge-response handshake, the other instrument might be an instrument that manages enabling or disabling different features of an IC.

CP Alternative Techniques

CP Tooling Requirements

CP Value Proposition

CP Consequences

Recycling prevention (RP)

Recycling Prevention aims at preventing that used ICs are mounted to produce new devices, without the IC manufacturer's consent and knowledge. This practice poses risks of security, safety and may endanger the IC manufacturer's reputation.

RP Application Fields

RP Detailed Description

RP Alternative Techniques

RP Tooling Requirements

RP Value Proposition

RP Consequences

Self Test for Functional Safety (FuSa)

Self-Test for Functional Safety refers to self-test measures that are done in the field, either periodically or upon a failure signal. These measures are widely required for safety-critical ICs as in automotive, medical, military, aerospace etc. applications.

FuSa Application Fields

FuSa Detailed Description

FuSa Alternative Techniques

FuSa Tooling Requirements

FuSa Value Proposition

FuSa Consequences